Wafer bonding machine is a device used to produce chips in semiconductor, optoelectronics, display and other industries. It is mainly used to glue different wafers together to form a single large wafer. Wafer bonding machine has the advantages of high precision, high speed and high reliability, which can improve production efficiency and ensure product quality.
Wafer bonding machine is one of the indispensable equipment in semiconductor manufacturing. The fabrication of semiconductor chips usually requires the combination of several wafers, which can be connected with high precision and high reliability by using wafer bonding technology. Wafer bonding machine can also achieve scratching, cutting, welding and other processes to achieve device reliability and performance improvement.
