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Modular wafer bonding system is our premium line of wafer bonding machines. YMJH offers bonding capabilities in small wafers and wafer sizes ranging from 2 "to 8". Modular design allows up to 12 heads (with scalability) from a single control unit. This saves valuable workbench space and allows for simple synchronous and asynchronous processing.
Wafer Bonding Machine - Modular wafer bonding system
Wafer Bonding Technology refers to the close combination of two homogeneous or heterogeneous chips that have been mirror-polished through chemical and physical action. After wafer bonding, the atoms on the interface react under the action of external forces to form covalent bonds and combine into a whole, and make the bonding interface reach specific bonding strength.
Equipment characteristics
● Modular configuration
● Automatic process cycle
● Handle 2-8 inch products
● Ultra-high wafers support disc parallelism
● Low/medium yield is used in production tools
● Industry-standard safety features
● Multi-functional scheme creation and automation mode
● Data collection and export
● Touch screen user interface
Advantages and characteristics
● High precision: The wafer bonding machine has a high precision, the diameter and thickness of each bonded wafer can reach the precise standard;
● High reliability: The key components of wafer bonding machine are all international first-class products, to ensure the high reliability of the equipment;
● High speed: The wafer bonding machine works fast and can process a large number of wafers in a short time;
● High automation: automatic control system can eliminate manual manipulation, greatly improve the work efficiency;
Technical parameter
| Chamber size | ≤8 Downward compatibility |
| Temperature range | ≤300℃ |
| Cycle time | 0-60min adjustable |
| Power | 220V |
Wafer Bonding Machine - Modular wafer bonding system
Wafer Bonding Technology refers to the close combination of two homogeneous or heterogeneous chips that have been mirror-polished through chemical and physical action. After wafer bonding, the atoms on the interface react under the action of external forces to form covalent bonds and combine into a whole, and make the bonding interface reach specific bonding strength.
Equipment characteristics
● Modular configuration
● Automatic process cycle
● Handle 2-8 inch products
● Ultra-high wafers support disc parallelism
● Low/medium yield is used in production tools
● Industry-standard safety features
● Multi-functional scheme creation and automation mode
● Data collection and export
● Touch screen user interface
Advantages and characteristics
● High precision: The wafer bonding machine has a high precision, the diameter and thickness of each bonded wafer can reach the precise standard;
● High reliability: The key components of wafer bonding machine are all international first-class products, to ensure the high reliability of the equipment;
● High speed: The wafer bonding machine works fast and can process a large number of wafers in a short time;
● High automation: automatic control system can eliminate manual manipulation, greatly improve the work efficiency;
Technical parameter
| Chamber size | ≤8 Downward compatibility |
| Temperature range | ≤300℃ |
| Cycle time | 0-60min adjustable |
| Power | 220V |
Heat transfer
Heat Transfer is a cooling oil used in YMJH systems;
Mounting adhesive
A range of sealers used to bond semiconductor, optical and geological samples;
Glass microscope slide
Glass microscope slides are used to fix thin rock, cement and soil sections;
Slide cover slide
Glass cover slides protect valuable thin sections and improve optical sharpness of transmission microscopy;
