The wafer-bonding machine contains a vacuum sucker inside the body. When the wafers are attached to the sucker, they can be positioned and glued using robotic arms and clamps. There are many bonding techniques used in wafer bonding machines, such as hot pressing bonding, radio frequency dielectric bonding, welding, etc. Each technique has its own applicable scenarios and advantages and disadvantages.
Wafer bonding machines are usually computer controlled and can complete the process automatically.Wafer bonding machines are widely used in various preparation processes in display manufacturing. Wafer bonding machines can glue multiple wafers into a large panel, with high precision and fast manufacturing speed, which can greatly improve production efficiency. For example, in the manufacture of LCD televisions and computer monitors, wafer bonding machines are often used for bonding and packaging between various panels and LCD glasses.
