Wafer bonding - Display manufacturing

In the process of LCD manufacturing, wafer bonding machines are mainly used for the assembly of laminating panels. Wafer bonding machine can accurately synthesize liquid crystal glass, TFT panel, FRP plate and other components into an integrated product under the operation of high precision and high speed, and complete the manufacture of liquid crystal display. At the same time, wafer bonding machines can also achieve multiplex on large panels, improving manufacturing efficiency.

Wafer bonding machines are widely used in various preparation processes. Wafer bonding machines can glue multiple wafers into a large panel, with high precision and fast manufacturing speed, which can greatly improve production efficiency. For example, in the manufacture of LCD televisions and computer monitors, wafer bonding machines are often used for bonding and packaging between various panels and LCD glasses. These displays often require the combination of multiple wafers to produce large display panels.

  Scope of application  

● Liquid Crystal Display (LCD)

● Organic light-emitting Diode Display (OLED)

● Organic Photoelectric Display (OPD)

In the electronics and display industries, wafer bonding technology can achieve large area, high definition, high brightness display effect, and thus has a wide range of applications in mobile devices, television, automotive dashboards, etc.