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Ultrasonic vibration is applied to the quartz head to clean the semiconductor wafer. High purity of cleanliness is achieved because the cleaning agent does not touch (rubber or other packaging) except quartz glass. It also saves cleaning chemicals compared to batch systems or washing-type cleaners. The quartz head (vibration unit) can be selectively modified to suit different shapes for different applications, such as low damage cleaning, large area cleaning, bevel or notching special objects.
Megasonic Cleaning Systems
Unit type
YMMS
Ultrasonic vibration is applied to the quartz head to clean the semiconductor wafer.High purity of cleanliness is achieved because the cleaning agent does not touch (rubber or other packaging) except quartz glass. It also saves cleaning chemicals compared to batch systems or washing-type cleaners.The quartz head (vibration unit) can be selectively modified to suit different shapes for different applications, such as low damage cleaning, large area cleaning, bevel or notching special objects.
Characteristics
Megasonic Cleaning Systems does not produce strong cavitation effect, which can avoid damage to the surface of the cleaning object and residual pollutants in the cleaning process. Megabound cleaning efficiency is high, time is short, the use of cleaning agent concentration is low, the consumption of chemical reagents is less, so the level of harm to the environment is low.
Device Features
Suitable wafer size: 4 inches, 8 inches, 12 inches;
Directly attached to the surface of the object to be cleaned, the energy conversion efficiency is higher;
Greatly reduce cleaning fluid usage;
Very low ultrasonic cavitation effect, no damage to the device surface;
No secondary contamination of cleaning solution;
Ultra-high cleaning precision, can remove 0.2 micron stain particles on the surface of the object;
Comprehensive non-metallic high anticorrosion material, suitable for all kinds of acid and alkali and organic solvents;
Quartz or sapphire matching layer technology without risk of impurities falling off the device;
Unique transducer fitting technology for higher stability and durability;
Innovative semiconductor technology megabound generator, fully realize digital high frequency power drive;
Application
CMP chemical mechanical polishing
Wash before bonding
Mask cleaning
developing
stripping
Lift-off metal stripping
Wet etching
The lens cleaning
Display and other microelectronics industry precision cleaning
Megasonic Cleaning Systems
Unit type
YMMS
Ultrasonic vibration is applied to the quartz head to clean the semiconductor wafer.High purity of cleanliness is achieved because the cleaning agent does not touch (rubber or other packaging) except quartz glass. It also saves cleaning chemicals compared to batch systems or washing-type cleaners.The quartz head (vibration unit) can be selectively modified to suit different shapes for different applications, such as low damage cleaning, large area cleaning, bevel or notching special objects.
Characteristics
Megasonic Cleaning Systems does not produce strong cavitation effect, which can avoid damage to the surface of the cleaning object and residual pollutants in the cleaning process. Megabound cleaning efficiency is high, time is short, the use of cleaning agent concentration is low, the consumption of chemical reagents is less, so the level of harm to the environment is low.
Device Features
Suitable wafer size: 4 inches, 8 inches, 12 inches;
Directly attached to the surface of the object to be cleaned, the energy conversion efficiency is higher;
Greatly reduce cleaning fluid usage;
Very low ultrasonic cavitation effect, no damage to the device surface;
No secondary contamination of cleaning solution;
Ultra-high cleaning precision, can remove 0.2 micron stain particles on the surface of the object;
Comprehensive non-metallic high anticorrosion material, suitable for all kinds of acid and alkali and organic solvents;
Quartz or sapphire matching layer technology without risk of impurities falling off the device;
Unique transducer fitting technology for higher stability and durability;
Innovative semiconductor technology megabound generator, fully realize digital high frequency power drive;
Application
CMP chemical mechanical polishing
Wash before bonding
Mask cleaning
developing
stripping
Lift-off metal stripping
Wet etching
The lens cleaning
Display and other microelectronics industry precision cleaning
