Wafer bonding - Optoelectronics manufacturing

Wafer bonding machines are widely used in semiconductor manufacturing, display manufacturing, optical fiber communication, optoelectronic equipment, solar cell manufacturing and other fields. In fiber optic communications, for example, wafer bonding machines are used to glue small components that make up optical components into a single unit;

Wafer bonding machines can be used for assembly and packaging of various products in optoelectronic equipment manufacturing. For example, in the manufacture of laser and optical communication devices, wafer bonding machines are mainly used to compose optical devices to solve the problem of optical signal transmission between transmitting devices and receiving devices, and improve the quality and speed of signal transmission.

Wafer bonding technology is applicable to many fields in the field of optoelectronic applications, such as: optical communication, optoelectronic storage, optoelectronic sensing, laser precision manufacturing, medical optoelectronics, etc. In these fields, wafer bonding technology can realize the combination of various materials (such as silicon wafer, sapphire, quartz, etc.), which plays an important role in device manufacturing, module assembly and so on.

  Scope of application  

● Manufacture laser with high intensity and high efficiency

● Assemble high-resolution image sensors

● Manufacture electrostatic servo and thermoelectric sensors

● Production of biochips for microflow control operations

● Manufacturing a variety of LED packaging

● Manufacturing solar cell modules

  Applicable material  

● Silicon

● Sapphire

● Silicon carbide

● Gallium nitride

● Diamond

● Lithium niobate

● Lithium tantalate

● Bismuth silicon oxide

● Barium titanate

● Other photoelectric materials